Siow, Kim S. - Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

Brand : Springer-Verlag GmbH, Binding : Gebundene Ausgabe, Edition : 1st ed. 2019, Label : Springer, Publisher : Springer, medium : Gebundene Ausgabe, numberOfPages : 279, publicationDate : 2019-02-07, publishers : Siow, Kim S., ISBN : 3319992554 ...