Balde, John W. - Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging) (Emerging Technology in Advanced Packaging, 1, Band 1)

Brand : Springer, Binding : Taschenbuch, Edition : Softcover reprint of the original 1st ed. 2003, Label : Springer, Publisher : Springer, medium : Taschenbuch, numberOfPages : 372, publicationDate : 2014-09-12, releaseDate : 2014-09-12, publishers : Balde, John W., ISBN : 146134977X ...